JPH0614477Y2 - ダミーウェハ - Google Patents
ダミーウェハInfo
- Publication number
- JPH0614477Y2 JPH0614477Y2 JP1988060788U JP6078888U JPH0614477Y2 JP H0614477 Y2 JPH0614477 Y2 JP H0614477Y2 JP 1988060788 U JP1988060788 U JP 1988060788U JP 6078888 U JP6078888 U JP 6078888U JP H0614477 Y2 JPH0614477 Y2 JP H0614477Y2
- Authority
- JP
- Japan
- Prior art keywords
- dummy wafer
- susceptor
- shape
- wafer
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988060788U JPH0614477Y2 (ja) | 1988-05-09 | 1988-05-09 | ダミーウェハ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988060788U JPH0614477Y2 (ja) | 1988-05-09 | 1988-05-09 | ダミーウェハ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01163331U JPH01163331U (en]) | 1989-11-14 |
JPH0614477Y2 true JPH0614477Y2 (ja) | 1994-04-13 |
Family
ID=31286485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988060788U Expired - Lifetime JPH0614477Y2 (ja) | 1988-05-09 | 1988-05-09 | ダミーウェハ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0614477Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60117736A (ja) * | 1983-11-30 | 1985-06-25 | Nec Corp | ベ−パ−エッチング方法 |
-
1988
- 1988-05-09 JP JP1988060788U patent/JPH0614477Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01163331U (en]) | 1989-11-14 |
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